Vapor-deposited perovskite semiconductors power next generation circuits

A research team has developed a groundbreaking technology poised to revolutionize next-generation displays and electronic devices.

Ultra-thin bismuth holds unexpected promise for green electronics

Electronic devices rely on materials whose electrical properties change with temperature, making them less stable in extreme conditions. A discovery that challenges conventional wisdom in physics suggests that bismuth, a metal, could serve as the foundation for highly stable electronic components. The researchers observed a mysterious electrical effect in ultra-thin bismuth that remains unchanged across a wide temperature range, from near absolute zero (-273 C) to room temperature.

Robotic touch sensors are not just skin deep

Researchers argue that the problem that has been lurking in the margins of many papers about touch sensors lies in the robotic skin itself.

'Cold' manufacturing approach to make next-gen batteries

Lithium-ion batteries have been a staple in device manufacturing for years, but the liquid electrolytes they rely on to function are quite unstable, leading to fire hazards and safety concerns. Now, researchers are pursuing a reliable alternative energy storage solution for use in laptops, phones and electric vehicles: solid-state electrolytes (SSEs).

Engineers advance toward a fault-tolerant quantum computer

Researchers demonstrated extremely strong nonlinear light-matter coupling in a quantum circuit. Stronger coupling enables faster quantum readout and operations, ultimately improving the accuracy of quantum operations.

New electronic 'skin' could enable lightweight night-vision glasses

Engineers developed a technique to grow and peel ultrathin 'skins' of electronic material that could be used in applications such as night-vision eyewear and autonomous driving in foggy conditions.

A cool fix for hot chips: Advanced thermal management technology for electronic devices

Researchers have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal transfer efficiency. This study could play a crucial role in the development of next-generation technology.