Tuesday, 1 June 2021
New method to improve durability of nano-electronic components, further semiconductor manufacturing
Researchers have developed a novel approach to mitigating electromigration in nanoscale electronic interconnects that are ubiquitous in state-of-the-art integrated circuits. This was achieved by coating copper metal interconnects with hexagonal boron nitride (hBN), an atomically-thin insulating two-dimensional (2D) material that shares a similar structure as the 'wonder material' graphene.
Subscribe to:
Post Comments (Atom)
Researchers develop recyclable, healable electronics
Electronics often get thrown away after use because recycling them requires extensive work for little payoff. Researchers have now found a w...
-
In this project, we will learn about the MCP2515 CAN Controller Module, how to interface the MCP2515 CAN Bus Controller with Arduino and fin...
-
Do you need a MOSFET gate resistor? What value should it be? And should it go before or after the pulldown resistor? If you’re a bit impati...
-
Smart LCD with Automatic Brightness Adjusting Using Arduino and LDR Sensor Here is a simple Arduino project that focuses on adjusting the b...
No comments:
Post a Comment