Tuesday, 1 June 2021

New method to improve durability of nano-electronic components, further semiconductor manufacturing

Researchers have developed a novel approach to mitigating electromigration in nanoscale electronic interconnects that are ubiquitous in state-of-the-art integrated circuits. This was achieved by coating copper metal interconnects with hexagonal boron nitride (hBN), an atomically-thin insulating two-dimensional (2D) material that shares a similar structure as the 'wonder material' graphene.
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