Wednesday 23 November 2022
Researchers develop a novel integration scheme for efficient coupling between III-V and silicon
Researchers have recently developed a novel integration scheme for efficient coupling between III-V compound semiconductor devices and silicon components on silicon photonics (Si-photonics) platform by selective direct epitaxy1, unlocking the potential of integrating energy-efficient photonics with cost-effective electronics, as well as enabling the next generation telecommunications with low cost, high speed and large capacity.
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