Tuesday, 19 September 2023

Researchers unveil new flexible adhesive with exceptional recovery and adhesion properties for electronic devices

A research team has developed novel crosslinkers utilizing m-xylylene diisocyanate (XDI) or 1,3-bis(isocyanatomethyl)cyclohexane (H6XDI) as hard segments along with poly(ethylene glycol) (PEG) groups serving as soft segments.
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