Thursday, 18 January 2024

Integrating dimensions to get more out of Moore's Law and advance electronics

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials.

No comments:

Post a Comment

Smart textiles and surfaces: How lightweight elastomer films are bringing tech to life

Clothes that can mimic the feeling of being touched, touch displays that provide haptic feedback to users, or even ultralight loudspeakers. ...