Thursday, 18 January 2024

Integrating dimensions to get more out of Moore's Law and advance electronics

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials.

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Polymer research shows potential replacement for common superglues with a reusable and biodegradable alternative

Researchers have developed an adhesive polymer that is stronger than current commercially available options while also being biodegradable, ...