Monday, 2 December 2024

Bendable electronic parts heat up by themselves like 'heat pack' and lower the manufacturing temperature barrier

A research team has developed liquid-processed thin-film transistors that can maintain high performance at low temperatures -- They are expected to be used in the next generation of high-performance flexible electronics and wearable devices as they can operate on plastic substrates and maintain stable performance under repeated mechanical bending.

No comments:

Post a Comment

New chiral photonic device combines light manipulation with memory

Engineers have developed a multifunctional, reconfigurable component for an optical computing system that could be a game changer in electro...